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By certification 
1. Miniature footprint: 1.25 X 1.00 X 0.80 mm3
2. Multilayer LTCC ( Low Temperature Ceramic Cofired ) Technology
3. Reflow solderable SMD Devices
4. Wide Pass Band ( Cut-Off Frequency: -3dB@ 4GHz Typical)
5. High Attenuation for common mode noise
6. Special 3D layout design to minimize phase shifting
2. Multilayer LTCC ( Low Temperature Ceramic Cofired ) Technology
3. Reflow solderable SMD Devices
4. Wide Pass Band ( Cut-Off Frequency: -3dB@ 4GHz Typical)
5. High Attenuation for common mode noise
6. Special 3D layout design to minimize phase shifting
